EMC for BGA Packages
Low-Warpage Control
KE-G1250 series has excellent properties for low warpage of organic substrate packages.
Features
- We have lineups of High Thermal Conductive EMC (3~6W/m K), EMC for MUF, and Compression Mold EMC.
- Our unique technology meets the low warpage requirements for all areas of array packages.
- Applicable to fine-pitch thin wire/Cu wire bonded package.
| Packages | F-BGA (Fine pitch BGA) | ||||
|---|---|---|---|---|---|
| General | High Heat Generation | ||||
| EMC | Type | General BGA | High thermal conductive | ||
| Requirement | Wire Bond Normal Gap Filling |
High Thermal Conductivity Normal/Narrow Gap Filling |
|||
| Mold | Transfer | Compression | Transfer | Compression | |
| Candidates | KE-G1250LKDS series* |
KE-G1250AH series* |
KE-G1250HT series* |
KE-G1250HT-A series* |
|
| Applications | Application Processor, NAND, Logic |
CPU, GPU, DRAM, Logic | |||
*Low alpha ray type (KE-G2250) is available.
Our Experts can help
