Mold Underfill (MUF) EMC for Flip-chip Package
Applications
- Applicable to package which needs to be filled into narrow gap such as FC-CSP, FC-SiP.
- High thermal conductive type for package with high heat generation.
Features
- Filling narrow gap with less void
- Optimized Mold Shrinkage, CTE, Modulus for various applications
- High thermal conductive type is available
- Applicable for both of transfer mold and compression mold
| Packages | FBGA (Fine pitch BGA) | ||
|---|---|---|---|
| Filip-Chip | |||
| EMC | Type | MUF(Mold Under Fill) | |
| Requirement | Small Sized Filler Type Narrow Gap Filling |
||
| Mold | Transfer | Compression | |
| Candidates | KE-G1250FC series* |
KE-G1250AH series* |
|
| Applications | DRAM, RF Module | ||
*Low alpha ray type (KE-G2250) is available.
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