Ceramic Packages for Edge-Emitting Lasers (Multi-Chip)
Multi-chip laser module technology offers great potential to miniaturize laser devices. Kyocera provides multi-chip laser module packages with superior thermal dissipation using ceramic materials and integrated, thermally conductive Cu bases.
Features
Hermetic Sealing
Superior Thermal Dissipation
Miniaturization
Surface Mounting
Bonding Dissimilar Materials
Concept Overview
Top-Emitting Devices
- Heat-Dissipating Package with Cu Base (thermal conductivity: 398 W/[m·K])
- Miniaturization Through Modularization with Multiple Chips
- Hermetically Sealed
Concept Without Cu
| Concept | Shape | Image | Cross-Section | Features |
|---|---|---|---|---|
| RGB Module | Convex shape |  |
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| Vertical mounting |  |
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FAQ
Applications
Materials
